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silicon ingot cylindrical grinding
silicon ingot grinding
silicon ingot
silicon ingot cylindrical grinding
silicon ingot grinding
silicon ingot

Diamond Wheels for Silicon Ingot, Peripheral Grinding/ OD Grinding

► Peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat

► For semiconductors and electronics parts, automobiles and photovoltaic industies
 


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Cylindrical Grinding Silicon Ingots

Peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat.
Materials used in semiconductors and electronics parts, automobiles and photovoltaic industry. Types of these materials are varied including silicon, sapphire, and gallium arsenide (GaAs). 
silicon ingot grinding
Features of cylindrical grinding wheel for silicon ingot
- Realizes a total-like cost cut by fast material removal
- Minimal influence on crystalline structure
- Low grinding load, good grinding performance and wear resistance
- Rngot surface with a high flat degree.
- Low dressing frequency
silicon ingot grinding wheel

Specifications of 6A2 Diamond Wheel for Cylindrical Grinding Silicon Ingot

D (mm) T (mm) H (mm) W (mm) X (mm) Materials
100 28 31.75 3, 5, 6, 9

3-8
Silicon, sapphire, and gallium arsenide (GaAs)
200 35, 50, 60 76, 80 3, 5, 6, 9
300 20, 30, 35 127 5, 7
350 40   5, 7
Rough / Fine grinding ( 100 - 1000#)
Other specifications can be custom according to the requirement
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