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back grinding wheel for silicon wafer
back grinding wheel for silicon wafer
back grinding wheel for silicon wafer
back grinding wheel for silicon wafer
back grinding wheel for silicon wafer
back grinding wheel for silicon wafer

Back Grinding Wheel for Surface Grinding Various Silicon Wafer

► Application: back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, gallium arsenide, GaN wafers, silicon-based chips, etc

► Grinding Machines: NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc

► Bonded: Vitrified bond & Resin bond

► Diameter (mm): 200mm, 250mm, 280mm, 300mm,  350mm
 


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silicon wafer back grinding

back grinding wheel back grinding wheel
Manufacturing Processes for Silicon Wafers

Ingot, cropping, Peripheral grinding, Ingot slicing, double disc grinding or lapping, edge grinding, surface grinding, polishing, back grinding, dicing, chips......
 

Applications of back grinding wheel
Back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, gallium arsenide, GaN wafers, silicon-based chips, etc
silicon wafer back grinding

Applicable Grinding Machine
The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH grinding machine, etc

Specifications of silicon wafer back grinding

 
Model D (mm) T (mm) H (mm)

6A2/6A2H
175 30, 35 76
200 35 76
350 45 127

6A2T
195 22.5, 25 170
280 30 228.6

6A2T(three ellipses)
350 35 235
209 22.5 158


The case of vitrified diamond wheel for grinding wafer silicon in the microchip industry
back grinding wheels back grinding wheels
Application Grinding wafer silicon in the microchip industry
Bonded Vitrified bond Diamond Wheel
Wheel Type 12A2T /C
Size 180*40*104*5*10, grit size  400#
180*40*104*5*10, grit size 1500#
180*40*104*5*10,  grit size 4000#

 
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