Silicon wafer back grinding is generally divided into two steps: rough grinding and fine grinding.
In the rough grinding stage, the diamond wheel with grit 46 # ~ 500 # , the axial feed speed is 100 ~ 500mm/min, and the grinding depth is generally 0.5 ~ 1mm.
The aim is to quickly remove most of the excess material (90% of the processing allowance) from the back of the silicon wafer.
In the process of fine grinding, the machining allowance is from several microns to more than ten microns. The diamond grinding wheel with grit 2000 # ~ 4000 #, and the axial feeding speed is 0.5 ~ 10mm/min.
It is mainly to eliminate the damage layer formed during rough grinding to reach the required thickness. In the fine grinding stage, the material is removed by ductility domain mode, and the surface damage of silicon wafer is significantly reduced.

PCD tool must ensure good cutting edge before machining workpiece. Diamond grinding wheel is the most widely used method. The higher the quality of the cutting edge, the finer the tool mark left at the junction of the geometric reflection region of the workpiece surface, and the higher the surface finish of the workpiece. Because cutting edge collapse or expansion easily cause tool wear or damage, reduce tool life. Edge collapse is a key index of edge quality of diamond tools.

The grain size of diamond grinding wheel should be one point coarser than that of the dressing grinding wheel, and the size of diamond particles should be close to the same, and the shape of diamond particles is approximately spherical. The commonly used particle size is 36# ~100#.

Peripheral Diamond Grinding wheels are used for indexable inserts grinding. Peripheral Diamond Grinding wheels for indexable inserts, must be of a high level of geometrical accuracy, with ability of significant material removal.
Grinding wheel size: D400*W12*X6, W20
Grinding inserts：CBN, SNGA two-edge
Equipment: HI-powerful Peripheral grinding machine HP400 PLUS

iamond powder is mainly used for grinding and polishing, the control of particle size is particularly important. As long as there are oversized coarse particles will cause workpiece scratches so that preceding operation come to naught. So the quality inspection of powder is an important link to ensure the quality of powder products.

Tool steel refers to a variety of carbon steel and alloy steel that are particularly well-suited to be made into tools. Their suitability comes from their distinctive hardness, resistance to abrasion and deformation, and their ability to hold a cutting edge at elevated temperatures.

Grain sizes for grinding tool steel are generally in the range 24-100 mesh.

Coarse grain izes are used for rapid rate of remo val, when grinding large workpieces, grinding softer materials or when the contact surface of the grinding whee is large. Fine grain sizes are used to oroduce high surface finish, when grinding hard materials or when the contact surface of the grinding whee is small. The surface smoothness of the ground part depends not only on the grain size of the grinding wheel. The sharpness of the wheel, the bonding material used and the hardness of th wheel also play a considerable part ir determining the surface finish produced.