May 19, 2022
Six Factors Affect the Quality of Semiconductor Dicing Blade
Moresuperhard Diamond Dicing Blades are suitable for cutting scribing glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), BGA, QFN (copper epoxy molding ), splitter, sapphire, ceramic substrate, alumina, aliminum nitride, etc.