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► Hubless type electroforming nickel bonded dicing blade
► Dicing blades thickness: 0.03mm - 0.3mm
► Silicon wafers of thickness 0.5 mm, 1 mm, 2 mm, 3 mm and 5 mm
► Inducing as low as possible frontside and backside chipping of silicon wafer
► Applications: dicing silicon wafers, copper wafer and compound semiconductor wafers such as GaAs and SiC.
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Applications of ultra thin electroformed diamond dicing blade
Scribing dicing silicon wafers, copper wafer and compound semiconductor wafers ( such as GaAs and SiC) , resistance, ceramic, packaging materials, lithium niobate, lithium tantalate, etc
How to selection of the correct types of dicing blades to cut materials
* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material
* Binder of metal bond (medium strength) dicing blade
* Binder of electroplated bond (hard bond), scribing softer material
Dresser Board for dressing dicing blades
Dresser board is used for dressing and edged blade row, to increase sharpness, and reduce the chipping of the work piece, to reshape and perfect the blade edge to a flat edge
| OD (mm) | Thickness (mm) |
ID (mm) | ||||
| size | tolernace | size | Standard Tolernace | High precision Tolernace | Size | Tolernace |
| 50 - 100 | + 0.02 | 0.03 - 0.06 | + - 0.005 | 25.4 30 31.75 40 60 80 88.9 |
+ - 0.02 | |
| 0.06 - 0.2 | + - 0.005 | + - 0.003 | ||||
| 0.2 - 0.4 | + - 0.005 | + - 0.003 | ||||
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Types |
Features |
Product Name |
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Easy to handle Variety of different grit concentrations Stable processing performance |
Hub dicing blade |
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Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3) |
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High processing quality for cutting of hard, brittle materials
Improved cut quality on hard materials |
Hubless dicing blade |
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Application:Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter |
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High rigidity minimized wavy&slant cutting Excellent rigidity and cut quality |
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Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP, |
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Wide selection of blade options Proprietary thin-blade technology Blade thickness - 0.015 mm to 0.3 mm Available for both dicing saws and slicers |
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Application: Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon |
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Other specification can be produced according to customers' requirements |
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