Polyurethane (PU) Polishing Pad for Wafer Surfaces Polishing

Details

Specifications

Polyurethane (PU) Polishing Pad for Wafer Surface

According to the different application fields of different polishing pads, optical products are divided into 4 categories:
♦ Ordinary optics, such as touch screen glass (including Windows glass, mobile phone glass, PAD, LCD glass can also fall into this category)
♦ Precision optics, all kinds of optical lenses, prisms, quartz glass, filters (blue glass), collimators
♦ Gallium arsenide, silicon carbide, sapphire substrate and epitaxial wafers, semiconductor wafers, and precision ceramics (zirconia ceramics, aluminum nitride ceramics)
♦ Infrared laser (such as this year's epidemic, the infrared industry is very hot, temperature control gun use is large)

Thickness For Polyurethane Polishing Pad

Standard thickness for PU polishing pads ranges from 0.020 inches (0.508 mm) to 0.20 inch (5.08 mm)

Model	Filler	Average Density G / cm³ (Ib / ft³ ）	Average Hardness shore - A	Application Area
MSH- 66	cerium oxide	0.42 (26)	78	Glass Crystal Metal Ceramic
MSH- 77	cerium oxide	0.43 (27)	78	Glass Crystal
MSH- 13	cerium oxide	0.35 (22)	66	Glass Crystal
MSH- LASER	zirconium oxide	0.59 (37)	90	Glass Metal Ceramic
MSH- 46	zirconium oxide	0.40 (25)	74	Glass Crystal
MSH- 26	zirconium oxide	0.57 (36)	88	Glass Crystal
MSH- 57	none	0.51 (32)	88	Glass Metal Ceramic Crystal
MSH- 87	none	0.77 (49)	96	Glass Metal Ceramic Crystal

Specifications of pu polishing pad

Shape	Dimensions (inches / mm)
Rectangle	23 x 55 "	584.2 x 1397 mm
Rectangle	36 x 71 "	914 x 1803 mm
Square	42 x 42 "	1066 x 1066 mm
Square	52 x 52 "	1320 x 1320 mm
Roundness	φ 26 "	660 mm
	φ 32 "	812 mm
	φ 38 "	965 mm
	φ 52 "	1320 mm
Custom sizes, shapes and configurations are available

Related Products

Back Grinding Wheel for Surface Grinding Various Silicon Wafer

Diamond Wheels for Silicon Ingot, Peripheral Grinding/ OD Grinding

Edge Grinding Wheel, Silicon Wafer Chamfering

Diamond Bandsaw Blades

Electroformed Diamond Dicing Blades - Hubless Type

Polyurethane (PU) Polishing Pad for Wafer Surface

Back Grinding Wheel for LED Substrate

Back Grinding Wheel for Silicon Wafer

Metal bond Diamond Dicing Blades for Silicon Wafer

Resin bond Diamond Dicing Blades for Silicon Wafer

Porous Ceramic Chuck Table

Inquiry

If you have any questions, feedback or comments, please fill out the form below and we will reply you back as soon as possible.

DRESSING

Stationary Diamond Dresser Rotary Diamond Roll Dressing Wheel Dressing Sticks

Consent

Details

About

This website uses cookies

We use cookies to personalise content and ads, to provide social media features and to analyse our traffic. We also share information about your use of our site with our social media, advertising and analytics partners who may combine it with other information that you’ve provided to them or that they’ve collected from your use of their services.

Necessary

Necessary cookies help make a website usable by enabling basic functions like page navigation and access to secure areas of the website. The website cannot function properly without these cookies.

Preferences

Preference cookies enable a website to remember information that changes the way the website behaves or looks, like your preferred language or the region that you are in.

Statistics

Statistic cookies help website owners to understand how visitors interact with websites by collecting and reporting information anonymously.

Marketing

Marketing cookies are used to track visitors across websites. The intention is to display ads that are relevant and engaging for the individual user and thereby more valuable for publishers and third party advertisers.

Deny

Customize

Allow all

Deny

Allow selection

Allow all

Deny

Customize

Allow all