The tool grinding machine HELITRONIC POWER 400 with C.O.R.E.-Technology is powerful with maximum flexibility for medium to large series.
It stands for top quality worldwide in the production and resharpening of rotationally symmetrical tools. It grinds tools in the diameter range from 3 to 315 mm, a machining length up to 520 mm and a piece weight up to 50 kg.
NEW: The new, innovative LASER CONTOUR CHECK option offers an intelligent measuring system integrated directly into the tool grinding and eroding machine...

Centerless Grinding Machine Guide Wheel is a common mechanical part, which usually consists of grinding tool, guide wheel and guide wheel seat. Among them, the guide wheel is a round wheel with a flange, which guides the abrasive tool to cut on the surface of the workpiece by contacting with the workpiece.

The customer is a manufacturer of high boron glass tubes used in scientific and industrial applications. They have their own honing machine and require a diamond honing stone to achieve a surface finish of R0.1 on the inner walls of the glass tubes. The high boron content makes the glass tube extremely hard and difficult to polish using conventional methods.

China International Optoelectronic Expo (CIOE) is the world's largest and most influential comprehensive exhibition of the optoelectronic industry, covering information and communications, lasers, infrared, ultraviolet, precision optics, chip materials, camera technology and applications, intelligent sensing, new display and other sections for the field of optoelectronics and applications to show the cutting-edge optoelectronic innovative technologies and comprehensive solutions, 2023 Mill Au Optoelectronics Group will once again go to the deep! In 2023, Mouma Optoelectronics Group will go to Shenzhen again to provide "cutting, grinding and polishing" solutions for your high-precision single-crystal cutting tools and the processing of photovoltaic semiconductor materials.

When grinding copper, it is typically recommended to use grinding wheels with relatively large porosity. Apart from the mentioned super-hard grinding wheels ( diamond and CBN mix abrasive grinding wheels) , other options suitable for copper grinding include corundum, silicon-carbide resin bonding wheels, or corundum ceramic bonding wheels that have large porosity. These types of wheels help facilitate the grinding process for copper materials by allowing efficient removal of material and preventing clogging.

In the semiconductor industry, the grinding accuracy of Japanese equipment is pretty good at present, and there are grinding processes combining free and consolidation, as well as pure consolidation processes. Manufacturers who can usually afford Japanese equipment generally use pure consolidation preparation processes. The top three Japanese semiconductor precision processing equipment are: Disico, Tokyo Precision, and SHUWA. SHUWA is widely used in the field of sapphire with high precision.